DAC 2026 – The Chips to Systems Conference
Business Profile
Core Value Proposition
DAC 2026 – The Chips to Systems Conference provides a global, premier venue for learning, showcasing, and advancing design engineering from chips to systems, featuring training, exhibits, and networking.
Target Customer
System architects, chip designers, engineers, researchers, and executives from 11,000+ organizations worldwide; designers, tool developers, and vendors seeking education, exhibitions, and collaboration in design automation.
Key Differentiator
Longstanding global event since 1963 that combines extensive technical sessions (60+), a large exhibit floor (approximately 150 exhibitors), and a broad network of industry and academic participants, with focus areas including AI/ML-enabled design tools, EDA, and IP.
Implementation Timeline
Value is realized during the conference dates (July 26-29, 2026) with pre-event activities such as Call for Contributions and sponsorship opportunities leading up to the event.
Pain Points
- 1Need to stay current with design automation trends and technologies (AI/ML tools, EDA, IP).
- 2Need access to a wide range of vendors and tools in one place (exhibits from leading and emerging companies).
- 3Need opportunities for training, networking, and presenting or discovering new research and practices.
Key Features
- 1Exhibition hall with 150 exhibitors showcasing AI/ML design tools, EDA, and IP
- 260+ expert-selected technical sessions
- 3Call for Contributions (paper submissions) for contributions to the conference
- 4Networking opportunities with industry leaders, researchers, and executives
- 5Special programs and contests (Systems Design Contest, Hack@DAC, DAC Young Fellows, Women in Technology @ DAC)
Target Customer Industries
Decision Makers
- 1General Chair
- 2Vice Chair
- 3Past Chair
- 4Finance Chair
- 5Publicity Chair
- 6Tutorial/Workshop Chair
- 7Exhibit Chair
- 8TPC Chair
- 9TPC Co-Chair
Client Results
- 1Access to 60+ sessions and 150 exhibitors for learning and evaluation of new tools and methods
- 2Networking with 11,000+ organizations worldwide and industry executives
- 3Opportunities to contribute knowledge via the conference (Call for Contributions) and participate in community programs
Competitive Advantages
- 1Long history and global reach (since 1963) with broad industry and academic participation
- 2Integrated mix of education, exhibitions, and networking in one event
- 3Strong sponsor and partner ecosystem (ACM, IEEE; SIGDA, CEDA) and a reputable organizing base
- 4Diverse program offerings (Hack@DAC, Systems Design Contest, Women in Technology @ DAC, DAC Young Fellows)
Key Benefits
Additional Product Information
Product Description
A premier, global conference for design engineering professionals focusing on the design and design automation of electronic chips to systems, featuring training, exhibitions, and networking with a wide range of industry participants.
Target Market
Design engineers, system architects, chip designers, researchers, tool developers, and executives in the electronics/semiconductor/EDA ecosystem; attendees from thousands of organizations worldwide.
Unique Value Proposition
A long-standing, authoritative venue that combines high-quality technical sessions, extensive vendor exhibitions, and rich community programs, enabling learning, collaboration, and advancement across chips-to-systems design.
Technical Requirements
Not specified in the provided content.
Pricing Model
Not specified in the provided content.
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